# Oma-ITA-AB

Description:
Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of  semiconductor wafers


Description:
Chemical vapor deposition apparatus for semiconductor production


Description:
Parts of chemical vapor deposition apparatus for semiconductor production


Description:
Apparatus for stripping or cleaning semiconductor wafers


Description:
Lasercutters for cutting contacting tracks in semiconductor production by laser beam


Description:
Parts of apparatus for stripping or cleaning semiconductor wafers


Description:
Encapsulation equipment for assembly of semiconductors


Description:
Automated machines for transport, handling and storage of  semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
Apparatus for physical deposition by sputtering on semiconductor wafers


Description:
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays


Description:
Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors


Description:
Machines for bending, folding and straightening semiconductor leads


Description:
Physical deposition apparatus for semiconductor production


Description:
Spinners for coating photographic emulsions on semiconductor wafers


Description:
Part of apparatus for physical deposition by sputtering on semiconductor wafers


Description:
Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors


Description:
Parts for spinners for coating photographic emulsions on semiconductor wafers


Description:
Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays


Description:
Parts of automated machines for transport, handling and storage of  semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
Parts of encapsulation equipment for assembly of semiconductors


Description:
Parts of machines for bending, folding and straightening semiconductor leads


Description:
Parts of physical deposition apparatus for semiconductor production


Description:
Apparatus for rapid heating of semiconductor wafers


Description:
Parts of apparatus for rapid heating of wafers


Description:
Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Parts and accessories  of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Electron beam microscopes fitted with equipment specifically designed for the handling and transport of  semiconductor wafers or reticles


Description:
Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of  semiconductor wafers or reticles


Description:
Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates


Description:
Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates


Description:
Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips


Description:
Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips


Description:
Parts of dicing machines for scribing or scoring semiconductor wafers


Description:
Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam


Description:
Parts of such pattern generating apparatus


Description:
Computers: automatic data processing machines capable of 1) storing the processing program or programs and at least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance with the requirements of the user; 3) performing arithmetical computations specified by the user; and 4) executing, without human intervention, a processing program which requires them to modify their execution, by logical decision during the processing run.  The agreement covers such automatic data processing machines whether or not they are able to receive and process with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified under Attachment A or B, are not covered by this agreement.


Description:
Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof


Description:
Flat panel display devices (including LCD, Electro Luminescence, Plasma, Vacuum-Fluorescence and other technologies) for products falling within this agreement, and parts thereof.


Description:
Network equipment: Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units - including adapters, hubs, in-line repeaters, converters, concentrators, bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof.


Description:
Monitors : display units of automatic data processing machines with a cathode ray tube with a dot screen pitch smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally processed audio or video signals without assistance of a central processing unit of a computer as defined in this agreement. The agreement does not, therefore, cover televisions, including high definition televisions.


Description:
Optical disc storage units, for automatic data processing machines (including CD drives and DVD-drives),  whether or not having the capability of writing/recording as well as reading, whether or not in their own housings.


Description:
Paging alert devices, and parts thereof  .


Description:
Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017.


Description:
Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements  "Active elements" means diodes, transistors, and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542.


Description:
Projection type flat panel display units used with automatic data processing machines which can display digital information generated by the central processing unit.


Description:
Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units.


Description:
Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP machines and units thereof to process audio signals (sound cards).


Description:
Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange


# Oma-ITA-stage

Description:
-Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics


Description:
--Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of  semiconductor wafers


Description:
---Spin dryers for semiconductor wafer processing


Description:
---Parts of spin dryers for semiconductor wafer processing


Description:
---Deflash machines for cleaning and removing contaminants from  the metal leads of semiconductor packages prior to the electroplating process


Description:
---Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays


Description:
---Spraying appliances for etching, stripping or cleaning semiconductor wafers


Description:
--Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays


Description:
--Parts of spraying appliances for etching, stripping or cleaning semiconductor wafers


Description:
--Automated machines for transport, handling and storage of  semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
---Automated machines for transport, handling and storage of  semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
---Parts of automated machines for transport, handling and storage of  semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
--Lasercutters for cutting contacting tracks in semiconductor production by laser beam


Description:
--Machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers


Description:
--For dry-etching patterns on semiconductor materials


Description:
---Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices


Description:
---Apparatus for stripping or cleaning semiconductor wafers


Description:
---Machines for bending, folding and straightening semiconductor leads


Description:
--Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips


Description:
--Grinding, polishing and lapping machines for processing of semiconductor wafers


Description:
--Dicing machines for scribing or scoring semiconductor wafers


Description:
--Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays


Description:
--Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips


Description:
--Parts of dicing machines for scribing or scoring semiconductor wafers


Description:
--Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam


Description:
--Parts of machines for bending, folding and straightening semiconductor leads


Description:
--Parts of apparatus for stripping or cleaning semiconductor wafers


Description:
--Parts of grinding, polishing and lapping machines for processing of semiconductor wafers


Description:
---Parts of focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices


Description:
---Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam


Description:
---Parts of machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers


Description:
---Parts of apparatus for stripping or cleaning semiconductor wafers


Description:
---Parts of machines for dry-etching patterns on semiconductor materials


Description:
---Parts of machines for bending, folding and straightening semiconductor leads


Description:
-Electronic calculators capable of operation without an external source of electric power and pocket-size data recording, reproducing and displaying machines with calculating functions


Description:
-Analogue or hybrid automatic data processing machines


Description:
-Portable digital automatic data processing machines, weighing not more than 10 kg, consisting of at least a central processing unit, a keyboard and a display


Description:
--Comprising in the same housing at least a central processing unit and an input and output unit, whether or not combined


Description:
--Other, presented in the form of systems


Description:
-Digital processing units other than those of subheadings 8471.41 and 8471.49, whether or not containing in the same housing one or two of the following types of unit: storage units, input units, output units


Description:
-Input or output units, whether or not containing storage units in the same housing


Description:
-Other units of automatic data processing machines


Description:
--Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements  "Active elements" means diodes, transistors, and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542.


Description:
--Of the electronic calculating machines of subheading No. 8470.10, 8470.21 or 8470.29


Description:
-Parts and accessories of the machines of heading No. 84.71


Description:
-Parts and accessories equally suitable for use with machines of two or more of the headings Nos. 84.69 to 84.72


Description:
--Encapsulation equipment for assembly of semiconductors


Description:
---Encapsulation equipment for assembly of semiconductors


Description:
--Parts of encapsulation equipment for assembly of semiconductors


Description:
---Apparatus for growing or pulling monocrystal semiconductor boules


Description:
---Chemical vapor deposition apparatus for semiconductor production


Description:
---Epitaxial deposition machines for semiconductor wafers


Description:
---Apparatus for physical deposition by sputtering on semiconductor wafers


Description:
---Physical deposition apparatus for for semiconductor production


Description:
---Spinners for coating photographic emulsions on semiconductor wafers


Description:
---Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors


Description:
--Parts of apparatus for growing or pulling monocrystal semiconductor boules


Description:
--Parts of chemical vapor deposition apparatus for semiconductor production


Description:
--Part of apparatus for physical deposition by sputtering on semiconductor wafers


Description:
--Parts of epitaxial deposition machines for semiconductor wafers


Description:
--Parts for spinners for coating photographic emulsions on semiconductor wafers


Description:
--Parts of physical deposition apparatus for for semiconductor production


Description:
--Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors


Description:
---Injection and compression moulds for the manufacture of semiconductor devices


Description:
--Static converters for automatic data processing machines and units thereof, and telecommunication apparatus


Description:
--Other inductors for power supplies for automatic data processing machines and units thereof, and telecommunication apparatus


Description:
--Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers


Description:
--Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductors wafers


Description:
--Parts of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers


Description:
--Apparatus for rapid heating of semiconductor wafers


Description:
--Parts of furnaces and ovens of Headings No 8514 10 to No 8514 30


Description:
--Parts of apparatus for rapid heating of wafers


Description:
--Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors


Description:
--Line telephone sets with cordless handsets


Description:
-Telephonic or telegraphic switching apparatus


Description:
-Other apparatus, for carrier-current line systems or for digital line systems


Description:
--Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use


Description:
---Loudspeakers, without housing, having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 50 mm, for telecommunication use


Description:
--Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof


Description:
--Of a width exceeding 4 mm but not exceeding 6.5 mm


Description:
--For reproducing phenomena other than sound or image


Description:
---For reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine


Description:
--Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units.


Description:
-Magnetic tapes for reproducing phenomena other than sound or image


Description:
--Transmission apparatus other than apparatus for radio-broadcasting or television


Description:
--Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange


Description:
-Transmission apparatus incorporating reception apparatus


Description:
--Portable receivers for calling, alerting or paging


Description:
--Paging alert devices, and parts thereof


Description:
---Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange


Description:
--Aerials or antennae of a kind used with apparatus for radio-telephony and radio-telegraphy


Description:
--Parts of:  transmission apparatus other than apparatus for radio-broadcasting or television transmission apparatus incorporating reception apparatus  digital still image video cameras,  portable receivers for calling, alerting or paging


Description:
-Indicator panels incorporating liquid crystal devices (LCD) or light emitting diodes (LED)


Description:
--Flat panel display devices (including LCD, Electro Luminescence, Plasma, Vacuum-Fluorescence and other technologies) for products falling within this agreement, and parts thereof.


Description:
--Parts of apparatus of subheading 8531 20


Description:
-Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive power handling capacity of not less than 0.5 kvar (power capacitors)


Description:
-Variable or adjustable (pre-set) capacitors


Description:
-Fixed carbon resistors, composition or film types


Description:
--For a power handling capacity not exceeding 20 W


Description:
-Other variable resistors, including rheostats and potentiometers


Description:
--Electronic AC switches consisting of optically coupled input and output circuits (Insulated thyristor AC switches)


Description:
--Electronic switches, including temperature protected electronic switches, consisting of a transistor and a logic chip (chip-on-chip technology) for a voltage not exceeding 1000 volts


Description:
--Electromechanical snap-action switches for a current not exceeding 11 amps


Description:
---Plugs and sockets for co-axial cables and printed circuits


Description:
--Connection and contact elements for wires and cables


Description:
-Diodes, other than photosensitive or light emitting diodes


Description:
--With a dissipation rate of less than 1 W


Description:
-Thyristors, diacs and triacs, other than photosensitive devices


Description:
-Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light emitting diodes


Description:
--Cards incorporating an electronic integrated circuit ("smart" cards)


Description:
--Metal oxide semiconductors (MOS technology)


Description:
--Circuits obtained by bipolar technology


Description:
--Other, including circuits obtained by a combination of bipolar and MOS technologies (BIMOS technology)


Description:
--Ion implanters for doping semiconductor materials


Description:
---Electrical machines with translation or dictionary functions


Description:
---Flat panel display devices (including LCD, Electro Luminescence, Plasma, Vacuum-Fluorescence and other technologies) for products falling within this agreement, and parts thereof.


Description:
--Parts of ion implanters for doping semiconductor materials


Description:
---Other electric conductors, for a voltage not exceeding 80 V, fitted with connectors, of a kind used for telecommunications


Description:
---Other electric conductors, for a voltage not exceeding 80 V, not fitted with connectors, of a kind used for telecommunications


Description:
---Other electric conductors, for a voltage exceeding 80 V but not exceeding  1000 V, fitted with connectors, of a kind used for telecommunications


Description:
--Operating by reproducing the original image directly onto the copy (direct process)


Description:
--Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49


Description:
--Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017.


Description:
--Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates


Description:
--Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates


Description:
--Parts of such pattern generating apparatus


Description:
-For measuring or checking the flow or level of liquids


Description:
-Spectrometers, spectrophotometers and spectrographs using optical radiations (UV, visible, IR)


Description:
-Other instruments and apparatus using optical radiations (UV, visible, IR)


Description:
--Parts and accessories of products of heading 9027, other than for gas or smoke analysis apparatus and microtomes


Description:
-Other instruments and apparatus, specially designed for telecommunications (for example, cross-talk meters, gain measuring instruments, distortion factor meters, psophometers)


Description:
--For measuring or checking semiconductor wafers or devices


Description:
--Parts and accessories of instruments and apparatus for measuring or checking semiconductor wafers or devices


Description:
--Parts of instruments and appliances for measuring or checking semiconductor wafers or devices


Description:
--For inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices


Description:
---Optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers


Description:
--Electron beam microscopes fitted with equipment specifically designed for the handling and transport of  semiconductor wafers or reticles


Description:
--Parts and accessories of optical instruments and appliances for  inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices


Description:
--Parts and accessories  of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
--Parts and accessories of optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers


Description:
--Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
--Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of  semiconductor wafers or reticles


