# US

Description:
Chemical elements doped for use in electronics, in form of discs, wafers or similar forms; chemical compounds doped for use in electronics.


Description:
Centrifuges, including centrifugal dryers, filtering or purifying machinery and apparatus, for liquids or gases; parts thereof.


Description:
---Spin dryers for semiconductor wafer processing


Description:
--Of centrifuges, including centrifugal dryers


Description:
----Of spin dryers of subheading 8421.19.30


Description:
Mechanical appliances (whether or not hand-operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines; parts thereof.


Description:
---Spraying appliances for etching, stripping or cleaning semiconductor wafers


Description:
---Of spraying appliances of subheading 8424.89 for etching, developing, stripping or cleaning semiconductor wafer and flat panel displays


Description:
Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes.


Description:
-Operated by laser or other light or photon beam processes


Description:
---For use in the production of semiconductor wafers; lasercutters for cutting contacting tracks in semiconductor production


Description:
--For dry-etching patterns on semiconductor materials


Description:
----Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices


Description:
Machine tools for working stone, ceramics, concrete, asbestos-cement or like mineral materials or for cold working glass.


Description:
--For processing of semiconductor wafers


Description:
--For wet-developing or -stripping semiconductor wafers; for wet-etching, -developing or -stripping flat panel displays


Description:
Parts and accessories suitable for use solely or principally with the machines of headings 8456 to 8465, including work or tool holders, self-opening dieheads, dividing heads and other special attachments for machine tools; tool holders for any type of tool for working in the hand.


Description:
----Of machines of subheading 8464.10 for sawing monocrystal semiconductor boules into slices, or wafers into chips; of machines of 8464.20.10; of machines of subheading 8464.90.10; of machines of subheading 8464.90.60


Description:
Typewriters other than printers of heading 8471; word processing machines.


Description:
-Automatic typewriters and word-processing machines:


Description:
Calculating machines and pocket-size data recording, reproducing and displaying machines with calculating functions; accounting machines, postage-franking machines, ticket-issuing machines and similar machines, incorporating a calculating device; cash registers.


Description:
-Electronic calculators capable of operation without an external source of electric power and pocket-size data recording, reproducing and displaying machines with calculating functions


Description:
Automatic data processing machines and units thereof; magnetic or optical readers, machines for transcribing data onto data media in coded form and machines for processing such data, not elsewhere specified or included.


Description:
-Portable digital automatic data processing machines, weighing not more than 10 kg, consisting of at least a central processing unit, a keyboard and a display


Description:
-Other digital automatic data processing machines:


Description:
--Comprising in the same housing at least a central processing unit and an input and output unit, whether or not combined


Description:
-Digital processing units other than those of subheadings 8471.41 and 8471.49, whether or not containing in the same housing one or two of the following types of unit: storage units, input units, output units


Description:
-Input or output units, whether or not containing storage units in the same housing


Description:
-Other units of automatic data processing machines


Description:
Other office machines (for example, hectograph or stencil duplicating machines, addressing machines, automatic banknote dispensers, coin-sorting machines, coin-counting or wrapping machines, pencil-sharpening machines, perforating or stapling machines).


Description:
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings  8469 to 8472.


Description:
-Parts and accessories of the machines of heading 8470:


Description:
--Of the electronic calculating machines of subheading 8470.10, 8470.21 or 8470.29


Description:
-Parts and accessories of the machines of heading 8471


Description:
-Parts and accessories equally suitable for use with machines of two or more of the headings 8469 to 8472


Description:
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter.


Description:
-Other machines and mechanical appliances:


Description:
---Of chemical vapor deposition machines for semiconductor production; of machines for cleaning semiconductor wafers; of physical deposition machines for semiconductor production; of die attach machines, of tape automated bonders and of wire bonders for assembly of semiconductors; of spinners for coating photographic emulsions on semiconductor wafers; of machines for growing or pulling monocrystal semiconductor boules; of machines for wet-cleaning flat panel displays; of epitaxial deposition machines for semiconductor wafers


Description:
Molding boxes for metal foundry; mold bases; molding patterns; molds for metal (other than ingot molds), metal carbides, glass, mineral materials, rubber or plastics.


Description:
---For the manufacture of semiconductor devices


Description:
Electrical transformers, static converters (for example, rectifiers) and inductors; parts thereof.


INR:
SE (only articles certified for use in civil aircraft)


Description:
--For power supplies for automatic data processing machines or units thereof of heading 8471; for telecommunication apparatus


Description:
Industrial or laboratory electric (including induction or dielectric) furnaces and ovens; other industrial or laboratory induction or dielectric heating equipment; parts thereof.


Description:
--For the manufacture of semiconductor devices on semiconductor wafers


Description:
-Induction or dielectric furnaces and ovens


Description:
--For the manufacture of semiconductor devices on semiconductors wafers


Description:
---For rapid heating of semiconductor wafers


Description:
--Of furnaces and ovens of subheading 8514.10 or 8514.20 for the manufacture of semiconductor devices on semiconductor wafers; of furnaces and ovens of subheading 8514.30.60


Description:
Electrical apparatus for line telephony or line telegraphy, including line telephone sets with cordless handsets and telecommunication apparatus for carrier-current line systems or for digital line systems; videophones; parts thereof.


Description:
--Line telephone sets with cordless handsets


Description:
-Telephonic or telegraphic switching apparatus


Description:
-Other apparatus, for carrier-current line systems or for digital line systems


Description:
Microphones and stands therefor; loudspeakers, whether or not mounted in their enclosures; headphones, earphones and combined microphone/speaker sets; audio-frequency electric amplifiers; electric sound amplifier sets; parts thereof.


Description:
--Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use


Description:
-Loudspeakers, whether or not mounted in their enclosures:


Description:
---Without housing, having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 50 mm, for telecommunication use


Description:
-Headphones, earphones and combined microphone/speaker sets


Description:
Magnetic tape recorders and other sound recording apparatus, whether or not incorporating a sound reproducing device.


Description:
Prepared unrecorded media for sound recording or similar recording of other phenomena, other than products of chapter 37.


Description:
--Of a width exceeding 4 mm but not exceeding 6.5 mm


Description:
Records, tapes and other recorded media for sound or other similarly recorded phenomena, including matrices and masters for the production of records, but excluding products of chapter 37.


Description:
--For reproducing phenomena other than sound or image

Base Rate:
$0.039 per square meter of recording surface


Description:
---For reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine; proprietary format recorded discs


Description:
-Magnetic tapes for reproducing phenomena other than sound or image

Base Rate:
$0.068 per square meter of recording surface


Description:
----For reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine; proprietary format recorded media


Description:
Transmission apparatus for radiotelephony, radiotelegraphy, radiobroadcasting or television, whether or not incorporating reception apparatus or sound recording or reproducing apparatus; television cameras; still image video cameras and other video camera recorders.


Description:
-Transmission apparatus incorporating reception apparatus


Description:
-Still image video cameras and other video camera recorders


Description:
Reception apparatus for radiotelephony, radiotelegraphy or radiobroadcasting, whether or not combined, in the same housing, with sound recording or reproducing apparatus or a clock.


Description:
Parts suitable for use solely or principally with the apparatus of headings 8525 to 8528.


Description:
-Antennas and antennas reflectors of all kinds; parts suitable for use therewith


Description:
---Antennas and antenna reflectors of a kind used with apparatus for radiotelephony and radiotelegraphy


Description:
----Of transmission apparatus of subheading 8525.10 other than apparatus for radiobroadcasting or television; of apparatus of subheading 8525.20; of digital still image video cameras of subheading 8525.40; of paging receivers of subheading 8527.90.90


Description:
Electric sound or visual signalling apparatus (for example, bells, sirens, indicator panels, burglar or fire alarms), other than those of heading 8512 or 8530; parts thereof.


Description:
-Indicator panels incorporating liquid crystal devices (LCD's) or light emitting diodes (LED's)


Description:
---Of the panels of subheading 8531.20; of paging alert devices or of flat panel displays for paging alert devices of subheading 8531.80


Description:
Electrical capacitors, fixed, variable or adjustable (pre-set); parts thereof.


Description:
-Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive power handling capacity of not less than 0.5 kvar (power capacitors)


Description:
-Variable or adjustable (pre-set) capacitors


Description:
Electrical resistors (including rheostats and potentiometers), other than heating resistors; parts thereof.


Description:
-Fixed carbon resistors, composition or film types


Description:
--For a power handling capacity not exceeding 20 W


Description:
-Wirewound variable resistors, including rheostats and potentiometers:


Description:
-Other variable resistors, including rheostats and potentiometers


Description:
Electrical apparatus for switching or protecting electrical circuits, or for making connections to or in electrical circuits (for example, switches, relays, fuses, surge suppressors, plugs, sockets, lamp-holders, junction boxes), for a voltage not exceeding 1,000 volts.


Description:
---Electronic AC switches consisting of optically coupled input and output circuits (insulated thyristor AC switches); electronic switches, including temperature protected electronic switches, consisting of a transistor and a logic chip (chip-on-chip technology); electromechanical snap-action switches for a current not exceeding 11 amps


Description:
---Coaxial connectors; cylindrical multicontact connectors; rack and panel connectors; printed circuit connectors; ribbon or flat cable connectors


Description:
--Terminals, electrical splices and electrical couplings; wafer probers


Description:
Diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light emitting diodes; mounted piezo-electric crystals; parts thereof.


Description:
-Diodes, other than photosensitive or light emitting diodes


Description:
-Transistors, other than photosensitive transistors:


Description:
--With a dissipation rate of less than 1 W


Description:
-Thyristors, diacs and triacs, other than photosensitive devices


Description:
-Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light emitting diodes


Description:
Electronic integrated circuits and microassemblies; parts thereof.


Description:
--Cards incorporating electronic integrated circuits ("smart" cards)


Description:
--Metal oxide semiconductors (MOS technology)


Description:
--Circuits obtained by bipolar technology


Description:
--Other, including circuits obtained by a combination of bipolar and MOS technologies (BIMOS technology)


Description:
Electrical machines and apparatus, having individual functions, not specified or included elsewhere in this chapter; parts thereof.


Description:
--Ion implanters designed for doping semiconductor materials


Description:
----Of ion implanters of subheading 8543.11; of flat panel displays other than for articles of subheading 8528


Description:
Insulated (including enameled or anodized) wire, cable (including coaxial cable) and other insulated electric conductors, whether or not fitted with connectors; optical fiber cables, made up of individually sheathed fibres, whether or not assembled with electric conductors or fitted with connectors.


Description:
-Other electric conductors, for a voltage not exceeding 80 V:


Description:
---Of a kind used for telecommunications


Description:
-Other electric conductors, for a voltage exceeding 80 V but not exceeding 1,000 V:


Description:
----Of a kind used for telecommunications


Description:
Photocopying apparatus incorporating an optical system or of the contact type and thermocopying apparatus; parts and accessories thereof.


Description:
--Operating by reproducing the original image directly onto the copy (direct process)


Description:
Apparatus and equipment for photographic (including cinematographic) laboratories (including apparatus for the projection or drawing of circuit patterns on sensitized semiconductor materials), not specified or included elsewhere in this chapter; negatoscopes; projection screens; parts and accessories thereof.


Description:
-Apparatus for the projection or drawing of circuit patterns on sensitized semiconductor materials:


Description:
---Of the apparatus of subheadings 9010.41 to 9010.49; of apparatus of subheading 9010.50.60 for the projection or drawing of circuit patterns on flat panel displays


Description:
Instruments and apparatus for measuring or checking the flow, level, pressure or other variables of liquids or gases (for example, flow meters, level gauges, manometers, heat meters), excluding instruments and apparatus of heading 9014, 9015, 9028 or 9032; parts and accessories thereof.


Description:
-For measuring or checking the flow or level of liquids


Description:
Instruments and apparatus for physical or chemical analysis (for example, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes; parts and accessories thereof.


Description:
-Spectrometers, spectrophotometers and spectrographs using optical radiations (UV, visible, IR)


Description:
-Other instruments and apparatus using optical radiations (UV, visible, IR)


Description:
Oscilloscopes, spectrum analyzers and other instruments and apparatus for measuring or checking electrical quantities, excluding meters of heading 9028; instruments and apparatus for measuring or detecting alpha, beta, gamma, X-ray, cosmic or other ionizing radiations; parts thereof.


Description:
-Other instruments and apparatus, specially designed for telecommunications (for example, cross-talk meters, gain measuring instruments, distortion factor meters, psophometers)


Description:
--For measuring or checking semiconductor wafers or devices


Description:
----Of instruments and apparatus of subheading 9030.82


Description:
Measuring or checking instruments, appliances and machines, not specified or included elsewhere in this chapter; profile projectors; parts and accessories thereof.


Description:
-Other optical instruments and appliances:


Description:
--For inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices


Description:
Laboratory, hygienic or pharmaceutical glassware, whether or not graduated or calibrated.


Description:
--Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers


Description:
-Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers


Description:
-Steam or sand blasting machines and similar jet projecting machines


Description:
---Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process (deflash by projectile beads)


Description:
---Spraying appliances for developing semiconductor wafers; spraying appliances for etching, developing, stripping or cleaning flat panel displays; deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process (deflash by high pressure spray)


Description:
Other lifting, handling , loading or unloading machinery (for example, elevators, escalators, conveyors, teleferics).


Description:
----For stripping or cleaning semiconductor wafers


Description:
Machine tools (including presses) for working metal by forging, hammering or die-stamping; machine tools (including presses) for working metal by bending, folding, straightening, flattening, shearing, punching or notching; presses for working metal or metal carbides, not specified above.


Description:
-Bending, folding, straightening or flattening machines (including presses):


Description:
---For bending, folding and straightening semiconductor leads


Description:
--For scribing or scoring semiconductor wafers; for wet-etching semiconductor wafers


Description:
Machine tools (including machines for nailing, stapling, glueing or otherwise assembling) for working wood, cork, bone, hard rubber, hard plastics or similar hard materials.


Description:
---Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process (deflash by chemical bath)


Description:
--Tool holders for the machines described in additional U.S. note 4 to chapter 84


Description:
--For machines described in additional U.S. note 4 to chapter 84


Description:
-Dividing heads and other special attachments for machine tools


Description:
---For machines described in additional U.S. note 4 to chapter 84


Description:
---Cast-iron parts not advanced beyond cleaning, and machined only for the removal of fins, gates, sprues and risers or to permit location in finishing machinery


Description:
---Bed, base, table, head, tail, saddle, cradle, cross slide, column, arm, saw arm, wheelhead, tailstock, headstock, ram, frame, work-arbor support, and C-frame castings, weldments or fabrications:


Description:
----Cast-iron parts not advanced beyond cleaning, and machined only for the removal of fins, gates, sprues and risers or to permit location in finishing machinery


Description:
-----Of machines of subheading 8456.10.60; of machines of subheading 8456.91; of machines of subheading 8456.99.10; of machines of subheading 8456.99.70


Description:
-----Of machines of subheading 8456.10.50; of machines of subheading 8456.91; of machines of subheading 8456.99.10; of machines of subheading 8456.99.70


Description:
---Cast-iron parts not advanced beyond cleaning, and machined only for the removal of fins, gates, sprues and risers or to permit location in finishing machinery:


Description:
----Bed, base, table, column, cradle, frame, bolster, crown, slide, rod, tailstock and headstock castings, weldments or fabrications


Description:
----Bed, base, table, column, cradle, frame, bolster, crown, slide, rod, tailstock and headstock castings, weldments or fabrications:


Description:
12.   Implementation of the concession on subheading 8518.90.40 is conditional upon the provision by other major countries of adequate entity coverage under the Agreement on Government Procurement.  A prior concession granted in the Tokyo Round (G/79) Schedule XX on subheading 8518.90.40 which was conditional upon the provision by other major countries of adequate entity coverage under the Agreement on Government Procurement are withdrawn.  The  base rate for subheading 8518.90.40 listed in this schedule is to be used in staging to the conditional concession on such subheading set forth in this schedule and such base rate shall be the most-favored nation (Rates of Duty 1 General) rate in the Harmonized Tariff Schedule of the United States (HTSUS) until such time as the concession is implemented.   [This note is not in the HTSUS.]


Description:
---Digital processing units entered with the rest of a system, whether or not containing in the same housing one or two of the following types of unit:  storage units, input units, output units


Description:
---Input or output units, entered with the rest of a system, whether or not containing storage units in the same housing:


Description:
------Without cathode-ray tube (CRT), having a visual display diagonal not exceeding 30.5 cm


Description:
-------With color cathode-ray tube (CRT)


Description:
-------Capable of producing more than 20 pages per minute


Description:
------Optical scanners and magnetic ink recognition devices


Description:
---Storage units, entered with the rest of a system


Description:
-----Units suitable for physical incorporation into automatic data processing machines or units thereof


Description:
--Digital processing units for automatic data processing machines, unhoused, consisting of a printed circuit (single or multiple) with one or more electronic integrated circuits or other semiconductor devices mounted directly thereon, certified as units designed for use other than in automatic data processing machines of subheading 8471.30 or 8471.41


Description:
----Without cathode-ray tube (CRT), having a visual display diagonal not exceeding 30.5 cm


Description:
----Assembled units incorporating at least the media transport, control and print mechanisms:


Description:
------Capable of producing more than 20 pages per minute


Description:
----Units suitable for physical incorporation into automatic data processing machines or units thereof


Description:
-----Optical scanners and magnetic ink recognition devices


Description:
---For a disk of a diameter exceeding 21 cm:


Description:
----Without read-write unit assembled therein; read-write units entered separately


Description:
----Units for physical incorporation into automatic data processing machines or units thereof


Description:
----Not assembled in cabinets, and without attached external power supply


Description:
---Not assembled in cabinets for placing on a table, desk, wall, floor or similar place


Description:
---Units suitable for physical incorporation into automatic data processing machines


Description:
-Parts and accessories of the machines of heading 8469


Description:
---Parts and accessories, including face plates and lock latches, of printed circuit assemblies


Description:
---Other parts for printer, specified in additional U.S. additional note 2 to this chapter


Description:
-Parts and accessories of the machines of heading 8472


Description:
--Printed circuit assembles for automatic teller machines of subheading 8472.90.10


Description:
--Parts and accessories, including face plates and lock latches, of printed circuit assemblies


Description:
Machinery for working rubber or plastics or for the manufacture of products from these materials, not specified or included elsewhere in this chapter; parts thereof.


Description:
--For encapsulation in the assembly of semiconductors


Description:
----Machines for processing of semiconductor materials; machines for production and assembly of diodes, transistors and similar semiconductor devices and electronic integrated circuits; machines for the manufacture of video laser discs


Description:
----Machines for wet-cleaning flat panel displays


Description:
--Power supplies for automatic data processing machines or units thereof of heading 8471:


Description:
---Suitable for physical incorporation into automatic data processing machines or units thereof of heading 8471


Description:
--Of power supplies for automatic data processing machines or units thereof of heading 8471:


Description:
----Of the goods of subheading 8504.40 and 8504.50 for telecommunication apparatus


Description:
Electric (including electrically heated gas), laser or other light or photon beam, ultrasonic, electron beam, magnetic pulse or plasma arc soldering, brazing or welding machines and apparatus, whether or not capable of cutting; electric machines and apparatus for hot spraying of metals or cermets; parts thereof.


Description:
--Die attach apparatus, tape automated bonders and wire bonders for assembly of semiconductors


Description:
---Of die attach apparatus, tape automated bonders and wire bonders for assembly of semiconductors of subheading 8515.80


Description:
--Telephonic switching apparatus (including private branch exchange and key system switching apparatus):


Description:
---Private branch exchange switching apparatus


Description:
13.  For the purposes of subheading 8538.90.10, the expression "articles described in additional U.S. note 12 to chapter 85" means any of the following goods:  spin dryers of subheading 8421.19.30; deflash machines of subheading 8424.30.90 for cleaning or removing contaminants from the metal leads of semiconductor packages prior to electroplating (deflash by projectile beads); spraying appliances of subheading 8424.89.30; machines or appliances of subheading 8424.89.50; automated machinery of subheading 8428.20, 8428.33, 8428.39 or 8428.90 for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other materials for semiconductor devices; machines of subheading 8456.10.60; machines of subheading 8456.91; machines of subheading 8456.99.10; machines of subheading 8456.99.70; machines of subheading 8462.21.40 or 8462.29.40; machines of subheading 8464.10 for sawing monocrystal semiconductor boules into slices, or wafers into chips; machines of subheading 8464.20.10; machines of 8464.90.10 or 8464.90.60; deflash machines of subheading 8465.99.40; articles of subheading 8469.11, heading 8470 or heading 8471; automatic teller machines of subheading 8472.90.10; machines of subheading 8477.10.80, 8477.40.40 or 8477.59.40; machines of subheading 8479.89.85 for processing of semiconductor materials or for production and assembly of diodes, transistors and similar semiconductor devices and electronic integrated circuits; machines of subheading 8479.89.87; furnaces and ovens of subheading 8514.10 or 8514.20 for the manufacture of semiconductor devices on semiconductor wafers; furnaces and ovens of subheading 8514.30.60; die attach apparatus, tape automated bonders and wire bonders for assembly of semiconductors of subheading 8515.80; articles of heading 8517; articles of subheading 8525.20; transmission apparatus of subheading 8525.10.10 or 8525.10.90; articles of subheading 8520.20; digital still image video cameras of subheading 8525.40.40; paging receivers of subheading 8527.90.85; ion implanters designed for doping semiconductor materials of subheading 8543.11; electrical machines with translation or dictionary functions of 8543.89.92; photocopying apparatus of subheading 9009.11 or 9009.21; apparatus of subheading 9010.41, 9010.42 or 9010.49; apparatus of subheading 9010.50.60 for the projection or drawing of circuit patterns on flat panel displays; plotters of subheading 9017.10.40 or 17.20.70; pattern generating apparatus of subheading 9017.20.50; instruments and apparatus of heading 9026; instruments and apparatus of heading 9027 except of subheading 9027.10, 9027.40 or 9027.90.20; instruments and apparatus of subheading 9030.40; instruments and apparatus of subheading 9030.82; other optical instruments and appliances of subheading 9031.41; optical instruments and appliances of subheading 9031.49.70; articles of subheading 9031.80.40.  [This note is additional U.S. note 12 in the HTSUS.]


Description:
--Modems, of a kind used with data processing machines of heading 8471


Description:
---Parts of facsimile machines specified in additional U.S. note 7 to this chapter


Description:
--Other parts, incorporating printed circuit assemblies:


Description:
----For telephonic switching or terminal apparatus


Description:
-----For switching or terminal apparatus (other than telephone sets)


Description:
---Parts, including face plates and lock latches, for printed circuit assemblies:


Description:
--For use as repeaters in line telephony


Description:
--Of line telephone handsets of subheading 8518.30.10; of repeaters of subheading 8518.40.10:


Description:
---Printed circuit assemblies of line telephone handsets of subheading 8518.30.10; parts of repeaters of subheading 8518.40.10


Description:
---Printed circuit assembles of the articles of subheading 8518.10.40 or 8518.29.40


Description:
Parts and accessories suitable for use solely or principally with the apparatus of headings 8519 to 8521.


Description:
--Parts of telephone answering machines:


Description:
---Set top boxes which have a communication function


Description:
---Low-power radiotelephonic transceivers operating on frequencies from 49.82 to 49.90 MHz:


Description:
----Infant nursery intercommunication systems, each consisting in the same package of a pair of transceivers operating on frequencies from 49.82 to 49.90 MHz, and an electrical adapter


Description:
----Of transmission apparatus of subheading 8525.10.90; of apparatus of subheading 8525.20; of digital still image video cameras of subheading 8525.40.40; of articles of subheading 8527.90.40; of paging receivers of subheading 8527.90.85


Description:
----Of transmission apparatus of subheading 8525.10.10.90; of apparatus of subheading 8525.20; of digital still image video cameras of subheading 8525.40.40; articles of subheading 8527.90.40; of paging receivers of subheading 8527.90.85


Description:
--Other parts of articles of headings 8525 and 8527, except parts of cellular telephones:


Description:
---Flat panel displays of paging alert devices of subheading 8531.80.40


Description:
--For the goods of subheading 8533.40, of ceramic or metallic materials, electrically or mechanically reactive to changes in temperature


Description:
Parts suitable for use solely or principally with the apparatus of heading 8535, 8536 or 8537.


Description:
---Of an article of heading 8537 for one of the articles described in additional U.S. note 13 to chapter 85


Description:
---For high definition television, having greater than 100,000 gates


Description:
-----Electrical machines with translation or dictionary functions; flat panel displays other than for articles of subheading 8528


Description:
---Fitted with modular telephone connectors


Description:
--Parts of photocopying apparatus of subheading 9009.12 specified in additional U.S. note 5 to this chapter:


Description:
---Parts other than photoreceptors or assemblies containing photoreceptors


Description:
---Parts and accessories, other than photoreceptors or assemblies containing photoreceptors, of electrostatic copying machines of subheading 9009.12


Description:
-Other apparatus and equipment for photographic (including cinematographic) laboratories; negatoscopes


Description:
Liquid crystal devices not constituting articles provided for more specifically in other headings; lasers, other than laser diodes; other optical appliances and instruments, not specified or included elsewhere in this chapter; parts and accessories thereof.


Description:
-Other devices, appliances and instruments


Description:
--Flat panel displays other than for articles of subheading 8528


Description:
--Of flat panel displays other than for articles of subheading 8528


Description:
Drawing, marking-out or mathematical calculating instruments (for example, drafting machines, pantographs, protractors, drawing sets, slide rules, disc calculators); instruments for measuring length, for use in the hand (for example, measuring rods and tapes, micrometers, calipers), not specified or included elsewhere in this chapter; parts and accessories thereof


Description:
-Drafting tables and machines, whether or not automatic


Description:
-Other drawing, marking-out or mathematical calculating instruments


Description:
--Pattern generating apparatus designed to produce masks and reticles from photoresist coated substrates (such as optical, E-beam, focused ion beam, X-ray or laser beam apparatus except those of subheading 8456.99.10)


Description:
--Printed circuit assemblies of plotters of subheading 9017.10.40

Base Rate:
The rate applicable to the article of which it is a part or accessory (4.3%)


Description:
---Heat meters incorporating liquid supply meters, and anemometers


Description:
--Of electrical instruments and apparatus


Description:
---Of flow meters, heat meters incorporating liquid supply meters and anemometers


Description:
---Electrophoresis instruments, not incorporating an optical or other measuring device


Description:
---Of electrical instruments and apparatus:


Description:
------Of electrophoresis instruments not incorporating an optical or other measuring device


Description:
----Of optical instruments and apparatus:


Description:
---For inspecting masks (other than photomasks) used in manufacturing semiconductor devices; for measuring surface particulate contamination on semiconductor wafers


Description:
--Of other optical instruments and appliances, other than test benches:


Description:
---Of optical instruments and appliances of subheading 9031.41 or 9031.49.70


Description:
-Other instruments, appliances and machines


Description:
--Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
-Analog or hybrid automatic data processing machines


Description:
--For automated transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
-Other continuous-action elevators and conveyors, for goods or materials:


Description:
---For automated transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
Parts suitable for use solely or principally with the machinery of headings 8425 to 8430.


Description:
---Of automated machines of subheading 8428.20, 8428.33, 8428.39 or 8428.90 for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
-Vacuum-molding machines and other thermoforming machines


Description:
--Transfer molding and compression molding machines for encapsulation in the assembly of semiconductors


Description:
-Other machinery for molding or otherwise forming:


Description:
---Liquid encapsulate molding machines for encapsulation in the assembly of semiconductors


Description:
--Base, bed, platen, clamp cylinder, ram, and injection castings, weldments and fabrications:


Description:
--Hydraulic assemblies incorporating more than one of the following:  manifold; valves; pump; oil cooler:


Description:
Reception apparatus for television, whether or not incorporating radiobroadcast receivers or sound or video recording or reproducing apparatus; video monitors and video projectors.


Description:
-Reception apparatus for television, whether or not incorporating radiobroadcast receivers or sound or video recording or reproducing apparatus:


Description:
------Set top boxes which have a communication function


Base Rate:
The rate applicable to the article of which it is a part or accessory (4.9%)

Bound Rate:
The rate applicable to the article of which it is a part or accessory (3.9%)


Description:
--Of the apparatus of subheading 9017.20.50

Base Rate:
The rate applicable to the article of which it is a part or accessory (0)


Description:
4.  For the purposes of subheading 8466.10.40, 8466.20.40 and 8466.30.40, the expression "machines described in additional U.S. note 4 to chapter 84" in this schedule means any of the following machines:  machines of subheading 8456.10.60; machines of subheading 8456.91; machines of 8456.99.10; machines of subheading 8456.99.70; machines of subheading 8462.21.40 or 8462.29.40; machines of subheading 8464.10 for sawing monocrystal semiconductor boules into slices, or wafers into chips; machines of subheading 8464.20.10; machines of subheading 8464.90.10; machines of subheading 8464.90.60.   [Additional U.S. note 4 to chapter 84 of this schedule (as added by WT/Let) is additional U.S. note 3 to chapter 84 of the HTSUS.]


Description:
----If certified for use in civil aircraft


Description:
---Drying chambers for the clothes-dryers of subheading 8421.12 and other parts of clothes-dryers incorporating drying chambers


Description:
---Furniture designed to receive the clothes-dryers of subheading 8421.12


Description:
--Of simple piston pump sprays and powder bellows


Description:
--If certified for use in civil aircraft


Description:
---If certified for use in civil aircraft


Description:
--Machinery for use in the manufacture of video laser discs


Description:
------If certified for use in civil aircraft


Description:
-------If certified for use in civil aircraft


Description:
--Articles designed for connection to telegraphic or telephonic apparatus or instruments or to telegraphic or telephonic networks


Description:
-----If certified for use in civil aircraft


Description:
---Infant nursery monitor systems, each consisting in the same package of a radio transmitter, an electrical adapter, and a radio receiver


Description:
---Incomplete or unfinished (including assemblies for television receivers consisting of all the parts specified in additional U.S. note 10 to this chapter plus a power supply), not incorporating a cathode-ray tube, flat panel screen or similar display device:


Description:
----Incorporating video recording or reproducing apparatus


Description:
---Non-high definition, having a single picture tube intended for direct viewing (non-projection type), with a video display diagonal not exceeding 35.56 cm:


Description:
----Incorporating video recording or reproducing apparatus:


Description:
-----With a video display diagonal not exceeding 33.02 cm


Description:
---Non-high definition, having a single picture tube intended for direct viewing (non-projection type), with a video display diagonal exceeding 35.56 cm:


Description:
--Other, parts of printed circuit assemblies, including face plates and lock latches:


Description:
---Of radar, radio navigational aid or radio remote control apparatus


Description:
-----Mounted lenses suitable for use in, and entered separately from, closed-circuit television cameras, with or without attached electrical or non-electrical closed-circuit television camera connectors, and with or without attached motors


Description:
----Subassemblies, for color television receivers, containing two or more printed circuit boards or ceramic substrates with components assembled thereon, except tuners or convergence assemblies:


Description:
-----Entered with components enumerated in additional U.S. note 4 to this chapter


Description:
---Of radar, radio navigational aid or radio remote control apparatus:


Description:
----Assemblies and subassemblies, consisting of 2 or more parts or pieces fastened or joined together


Description:
--For machine tools used in cutting gears


Description:
-----Of metalworking machine tools for cutting gears


Description:
---Non-high definition, projection type, with a cathode-ray tube:


Description:
---High definition, non-projection type, with a cathode-ray tube:


Description:
---High definition, projection type, with a cathode-ray tube:


Description:
--Radar, radio navigational aid and radio remote control


Description:
----Printed circuit boards and ceramic substrates with components assembled thereon, for color television receivers; subassemblies containing one or more of such boards or substrates, except tuners or convergence assemblies:


Description:
--Other, for the articles of subheading 8535.90.40, 8536.30.40 or 8536.50.40, of ceramic or metallic materials, electrically or mechanically reactive to changes in temperature


Description:
---Electric synchros and transducers; flight data recorders; defrosters and demisters with electric resistors for aircraft


Description:
--------If certified for use in civil aircraft


Description:
----If certifed for use in civil aircraft


Description:
--Numbering, dating and check-writing machines


Description:
--Accessory and auxiliary machines which are intended for attachment to an electrostatic photocopier and which do not operate independently of such photocopier


Description:
--Parts and accessories of the goods of subheading 8472.90.70


Description:
--For use in the manufacture of video laser discs


Description:
---Electromechanical appliances with self-contained electric motor:


Description:
-----Toilet units specially designed for aircraft; mechanical actuators for thrust reversers; all the foregoing, if certified for use in civil aircraft


Description:
-----Nonelectric starter motors; propeller regulators, nonelectric; servo-mechanisms, nonelectric; windshield wipers, nonelectric; hydropneumatic accumulators; pneumatic starters for turbojets, turbopropellers or other gas turbines; toilet units specially designed for aircraft; mechanical actuators for thrust reversers; air humidifiers and dehumidifiers; all the foregoing, if certified for use in civil aircraft


Description:
---Of air humidifiers or dehumidifiers, if certified for use in civil aircraft


Description:
---Frame assemblies incorporating more than one of the following:  baseplate; side frames; power screws; front plates


Description:
---Ram assemblies incorporating a ram wrapper and/or ram cover


Description:
--Transceiver assemblies for the apparatus of subheading 8526.10, other than printed circuit assemblies


Description:
--Parts of television receivers specified in additional U.S. note 10 to this chapter, other than printed circuit assemblies:


Description:
---Subassemblies, for color television receivers, containing two or more printed circuit boards or ceramic substrates with components assembled thereon, except tuners or convergence assemblies:


Description:
----Entered with components enumerated in additional U.S. note 4 to this chapter


Description:
--Combinations of parts specified in additional U.S. note 10 to this chapter:


Description:
---Articles designed for connection to telegraphic or telephonic apparatus or instruments or to telegraphic or telephonic networks


Description:
--Assemblies and subassemblies for flight data recorders, consisting of two or more parts or pieces fastened or joined together:


Description:
--Photographic film viewers, titlers, splicers and editors, all the foregoing and combinations thereof:


Description:
---Articles containing an optical lens or designed to contain such a lens:


Description:
----Editors and combination editor-splicers, for cinematographic film


Description:
---Container assemblies incorporating more than one of the following:  container bottom; container wrapper; slide track; container front


Description:
---Of nonelectric starter motors; of propeller regulators, nonelectric; of servo-mechanisms, nonelectric; of windshield wipers, nonelectric; of hydropneumatic accumulators; of pneumatic starters for turbojets, turbopropellers or other gas turbines; of toilet units specially designed for aircraft; of mechanical actuators for thrust reversers; of air humidifiers and dehumidifiers; all the foregoing, if certified for use in civil aircraft


Description:
--Speed drive controllers for electric motors


Base Rate:
3% (delayed implementation of start of staging until 1/1/96)


Description:
--Of photographic film viewers, titlers, splicers, editors or any combination of the foregoing


Description:
--Hand magnifiers, magnifying glasses, loupes, thread counters and similar apparatus


Description:
--Disc calculators, slide rules and other mathematical calculating instruments


Description:
--Printed circuit assemblies of plotters of subheading 9017.20.70

Base Rate:
The rate applicable to the article of which it is a part or accessory (5.1%)


Base Rate:
The rate applicable to the article of which it is a part or accessory (5.8%)

Bound Rate:
The rate applicable to the article of which it is a part or accessory (4.6%)


Bound Rate:
The rate applicable to the article of which it is a part or accessory (5.8%)


Base Rate:
The rate applicable to the article of which it is a part or accessory (5.3%)

Bound Rate:
The rate applicable to the article of which it is a part or accessory (5.3%)


Description:
--For diffusion, oxidation or annealing of semiconductor wafers


Description:
----Printed circuit assemblies for the goods of subheading 9027.80


Bound Rate:
4.3% (see additional U.S. note 12 to chapter 85 of this schedule)


Description:
--Assemblies and subassemblies of articles provided for in subheading 8520.90, consisting of two or more pieces fastened or joined together:


Description:
---Master records or metal matrices therefrom for use in the production of sound records for export; recordings on wire


Base Rate:
$0.097 per square meter of recording surface


Description:
---Bases and frames for the coordinate-measuring machines of subheading 9031.49.40


Description:
--Articles, other than printed circuit assemblies,  of plotters of subheading 9017.10.40


Description:
--Articles, other than printed circuit assemblies,  of plotters of subheading 9017.20.70


# US-AB

Description:
Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of  semiconductor wafers


Description:
Chemical vapor deposition apparatus for semiconductor production


Description:
Parts of chemical vapor deposition apparatus for semiconductor production


Description:
Apparatus for stripping or cleaning semiconductor wafers


Description:
Lasercutters for cutting contacting tracks in semiconductor production by laser beam


Description:
Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips


Description:
Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips


Description:
Parts of dicing machines for scribing or scoring semiconductor wafers


Description:
Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam


Description:
Parts of apparatus for stripping or cleaning semiconductor wafers


Description:
Encapsulation equipment for assembly of semiconductors


Description:
Automated machines for transport, handling and storage of  semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
Apparatus for physical deposition by sputtering on semiconductor wafers


Description:
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays


Description:
Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors


Description:
Machines for bending, folding and straightening semiconductor leads


Description:
Physical deposition apparatus for semiconductor production


Description:
Spinners for coating photographic emulsions on semiconductor wafers


Description:
Part of apparatus for physical deposition by sputtering on semiconductor wafers


Description:
Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors


Description:
Parts for spinners for coating photographic emulsions on semiconductor wafers


Description:
Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays


Description:
Parts of automated machines for transport, handling and storage of  semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices


Description:
Parts of encapsulation equipment for assembly of semiconductors


Description:
Parts of machines for bending, folding and straightening semiconductor leads


Description:
Parts of physical deposition apparatus for semiconductor production


Description:
Apparatus for rapid heating of semiconductor wafers


Description:
Parts of apparatus for rapid heating of wafers


Description:
Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Parts and accessories  of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles


Description:
Electron beam microscopes fitted with equipment specifically designed for the handling and transport of  semiconductor wafers or reticles


Description:
Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of  semiconductor wafers or reticles


Description:
Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates


Description:
Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates


Description:
Parts of such pattern generating apparatus


Description:
Computers: automatic data processing machines capable of 1) storing the processing program or programs and at least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance with the requirements of the user; 3) performing arithmetical computations specified by the user; and 4) executing, without human intervention, a processing program which requires them to modify their execution, by logical decision during the processing run.  The agreement covers such automatic data processing machines whether or not they are able to receive and process with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified under Attachment A or B, are not covered by this agreement.


Description:
Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof


Description:
Flat panel display devices (including LCD, Electro Luminescence, Plasma, Vacuum-Fluorescence and other technologies) for products falling within this agreement, and parts thereof.


Description:
Network equipment: Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units - including adapters, hubs, in-line repeaters, converters, concentrators, bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof.


Description:
Monitors : display units of automatic data processing machines with a cathode ray tube with a dot screen pitch smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally processed audio or video signals without assistance of a central processing unit of a computer as defined in this agreement. The agreement does not, therefore, cover televisions, including high definition televisions.


Description:
Optical disc storage units, for automatic data processing machines (including CD drives and DVD-drives),  whether or not having the capability of writing/recording as well as reading, whether or not in their own housings.


Description:
Paging alert devices, and parts thereof  .


Description:
Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017.


Description:
Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements  "Active elements" means diodes, transistors, and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542.


Description:
Projection type flat panel display units used with automatic data processing machines which can display digital information generated by the central processing unit.


Description:
Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units.


Description:
Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP machines and units thereof to process audio signals (sound cards).


Description:
Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange


Description:
Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electronplating process


Description:
Dicing Machines for scribing or scoring semiconductor wafers


Description:
Parts of grinding , polishing and lapping machines for processing of semiconductor wafers


Description:
Parts of focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices


Description:
Parts of machines for working any material by removal of material, by laser or other lights or photon beam in the production of semiconductor wafers


Description:
Parts of machines for dry-etching patterns on semiconductor materials


Description:
Apparatus for projection, drawing or plating circuit patterns on sensitized semiconductor materials and flat panel displays


Description:
Optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices


# US-M

Base::
$0.039 per square meter of recording surface

July 1997::
$0.026 per square meter of recording surface

1998::
$0.013 per square meter of recording surface


Base::
$0.068 per square meter of recording surface

July 1997::
$0.051 per square meter of recording surface

1998::
$0.034 per square meter of recording surface

1999::
$0.017 per square meter of recording surface


